Intellectual Properties

IP, Reports & Roadmaps | Apr 29, 2017
NICHIA ANNOUNCES EXPANDED PATENT CROSS LICENSE WITH CREE AND FILES LAWSUITE AGAINST SEOUL SEMICONDUTOR LTD IN KOREA
Nichia Corporation today announced that Nichia and Cree, Inc. (Nasdaq: CREE) have entered into an agreement that expands their cross license arrangements announced in 2002 and 2005 to include additional patents relating to white LED technology and certain Cree patents relating to nitride lasers. At the same time Nichia filed a lawsuit in the Seoul Central District Court against Seoul Semiconductor Co., Ltd. ("Seoul Semiconductor") for infringing Nichia's patent. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Nichia and Luminus Enter Cross Licensing and Manufacturing Partnership
Nichia Corporation and Luminus Devices Inc., today announced an alliance based on cross-licensing of intellectual property, technology sharing, and a manufacturing partnership. The two companies have agreed to combine their expertise and resources in order to bring to the market a new breed of high power white LEDs. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Nexxus Lighting Issued Two New LED Lighting Technology Patents
Nexxus Lighting, Inc. (NASDAQ Capital Market: NEXS) a world leader in advanced lighting technology, including solid-state LED and fiber optic lighting systems and controls used in commercial, architectural, signage, swimming pool and retail lighting today announced that it has been issued two new patents related to its LED lighting technology. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Nexxus Lighting Issued New Patent for Submersible LED Lighting Technology
Nexxus Lighting, Inc. (NASDAQ CAPITAL:NEXS), a world leader in advanced lighting technology, including solid-state LED and fiber optic lighting systems and controls used in commercial, architectural, signage, swimming pool and retail lighting, today announced that it has been issued a new patent related to its LED lighting technology. US patent number 7,303,301 is for a unique method of heat sinking an LED light engine in a lighting fixture when it is submerged in a body of water. Read more »
Resources | Intellectual Properties | Applications | Lamps | Tubes | Apr 29, 2017
New Patent Aims to Improve Light Distribution of Tubular Lamps and Luminaires
New Patent Aims to Improve Light Distribution of Tubular Lamps and Luminaires Appropriate even light distribution in LED replacement tubes respectively tubular LED lamps and luminaires is still one of the weak points of LED lighting. Recently the interesting patent application "Light distribution using tapered waveguides in LED-based tubular lamps as replacements of linear fluorescent lamps" covering that topic became a granted patent, with patent number US8,348,467 B2. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Monolithic multi-color, multi-quantum well semiconductor LED
Monolithic multi-color, multi-quantum well semiconductor LED A monolithic, multi-color semiconductor light emitting diode (LED) is formed with a multi-bandgap, multi-quantum well (MQW) active light emitting region which emits light at spaced-apart wavelength bands or regions ranging from UV to red. The MQW active light emitting region comprises a MQW layer stack including n quantum barriers which space apart n−1 quantum wells. Embodiments include those wherein the MQW layer stack includes quantum wells of at least two different bandgaps for emitting light of two different wavelengths, e.g., in the blue or green regions and in at least one other region, and the intensities of the emissions are adjusted to provide a preselected color of combined light emission, preferably white light.m barrier, a 3rd green quantum well, a quantum barrier, a 1st blue quantum well, a quantum barrier, a 2nd blue quantum well, and a quantum barrier. Read more »
News-Spot | IP, Reports & Roadmaps | Apr 29, 2017
Mitsubishi Chemical Corporation Files Patent Infringement Lawsuit Against Red Phosphors in Korea
On December 20th, 2011, Mitsubishi Chemical Corporation (“MCC” “; Head office: Minato-ku, Tokyo; President: Yoshimitsu Kobayashi), has filed an infringement lawsuit in Seoul Central District Court against a USpany, Intematix Corporation and a Korean distributor, GVP, to enjoin them from importing and selling their phosphor products, claiming that they infringe a red phosphor patent in Korea (No. 816693) which is owned by MCC and National Institute of Material Science. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Method of making a vertical light emitting diode
Method of making a vertical light emitting diode Methods are disclosed for forming a vertical semiconductor light emitting diode (VLED) device having an active layer between an n-doped layer and a p-doped layer; and securing a plurality of balls on a surface of the n-doped layer of the VLED device. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Method for manufacturing super bright light emitting diode of nanorod array having InGaN quantum well
Method for manufacturing super bright light emitting diode of nanorod array having InGaN quantum well An GaN light emitting diode (LED) having a nanorod (or, nanowire) structure is disclosed. The GaN LED employs GaN nanorods in which a n-type GaN nanorod, an InGaN quantum well and a p-type GaN nanorod are subsequently formed in a longitudinal direction by inserting the InGaN quantum well into a p-n junction interface of the p-n junction GaN nanorod. In addition, a plurality of such GaN nanorods are arranged in an array so as to provide an LED having much greater brightness and higher light emission efficiency than a conventional laminated-film GaN LED. Read more »
News-Spot | Resources | Intellectual Properties | Licensing | Apr 29, 2017
Lumitech Licenses Seoul Semiconductor for PI-LED Technology Applications
Lumitech Licenses Seoul Semiconductor for PI-LED Technology Applications Seoul Semiconductor, a global leading LED components manufacturer from Korea, and the Austrian company Lumitech, a leading manufacturer of components for Human Centric Lighting announced a licensing agreement for PI-LED technology patents. These patents govern the industrial trade mark rights of Lumitech’s PI-LED technology, which can implement tunable white from 2.500 to 7.000K with perfect colour rendering in a high and constant efficiency. Based on the license agreement, Seoul Semiconductor has the right to offer tunable white components based on the leading PI-LED technology, worldwide. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Luminus Devices Collects Ten More Patents - Now has 21 Patents Issued, with 120 Applications Pending
Luminus Devices, Inc., the developer and manufacturer of PhlatLight® (Photonic Lattice) LEDs that are used in display and lighting applications, today announced it has received its 21st United States patent for its PhlatLight technology. This rapidly growing patent portfolio highlights Luminus Devices’ technology leadership in the LED industry. And with 120 additional patents pending in the United States and foreign countries, Luminus will continue its leadership in solid state lighting innovation. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Luminus Devices Awarded 50th U.S. Patent For ‘Big-Chip’ LEDs
Luminus Devices, developer and manufacturer of ‘big-chip’ PhlatLight® LEDs, today announced that the United States Patent and Trademark Office (USPTO) recently awarded the company its 50th patent. Having pioneered big-chip LED technology, Luminus has aggressively filed intellectual property (IP) for protection of big chip LED devices, packages and systems. In addition, the company has also been granted 13 non-U.S. issued patents in China, Korea and Taiwan that extend big-chip LED protection into those countries. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Lighting Science Group Obtains Preliminary Injunction Order Against Philips
Lighting Science Group Corporation (OTC Bulletin Board: LSCG) (LSG), a developer and integrator of intelligent LED lighting solutions, today announced that on October 7, 2008, the Superior Court of California for Sacramento County issued a preliminary injunction against Philips Solid State Lighting Solutions, Inc., Koninklijke Philips Electronics N.V. and Philips Electronics North America Corporation (collectively "Philips") preventing Philips from using or relying on certain confidential or trade secret information obtained from LSG. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Lighting Science Group Announces Developments in Litigation with Philips Electronics
Lighting Science Group Corporation (OTC Bulletin Board: LSCG) (LSG), a developer and integrator of intelligent LED lighting solutions, today announced in conjunction with its annual shareholders' meeting, that there have been further developments in its on-going dispute with Philips Solid State Lighting Solutions, Inc., Koninklijke Philips Electronics N.V. and Philips Electronics North America Corporation (collectively "Philips"). Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Light emitting diodes packaged for high temperature operation
Light emitting diodes packaged for high temperature operation In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal base. The LED is thermally coupled through the metal base to the thermal connection pad, and the electrodes are electrically connected to the underlying electrical connection pads. A low thermal resistance insulating layer can electrically insulate other areas of die from the base while permitting heat passage. Heat flow can be enhanced by thermal vias to the thermal connector pad. Ceramic layers formed overlying the base can add circuitry and assist in distributing emitted light. The novel package can operate at temperatures as high as 250.degree. C. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Light Emitting Diodes packaged for high temperature operation
Light Emitting Diodes packaged for high temperature operation In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal base. The LED is thermally coupled through the metal base to the thermal connection pad, and the electrodes are electrically connected to the underlying electrical connection pads. A low thermal resistance insulating layer can electrically insulate other areas of die from the base while permitting heat passage. Heat flow can be enhanced by thermal vias to the thermal connector pad. Ceramic layers formed overlying the base can add circuitry and assist in distributing emitted light. The novel package can operate at temperatures as high as 250°C. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Light emitting diode package with protective function against electrostatic discharge
Light emitting diode package with protective function against electrostatic discharge The present invention provides an LED package having an MEMS switch operated by electrostatic force, capable of continuously protecting an LED from excessive current due to electrostatic discharge. The invention includes a submount with first and second electrode patterns formed thereon; an LED mounted on the submount, having an n-electrode electrically connected to the first electrode pattern and a p-electrode electrically connected to the second electrode pattern; and an MEMS switch including a first conductive plate and a second conductive plate bent to have an area over and vertically apart from the first conductive plate, wherein the first and second conductive plates are electrically connected to the first and second electrode patterns, and the second conductive plate comes in contact with the first conductive plate by electrostatic force upon being applied with voltage higher than a predetermined level of voltage. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Light Emitting Diode Package with Diffusor and method of manufacturing the same
Light Emitting Diode Package with Diffusor and method of manufacturing the same The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Light emitting diode package having multiple molding resins
Light emitting diode package having multiple molding resins Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals. At least portions of the pair of lead terminals are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding resin covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented. Read more »
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