Intellectual Properties

IP, Reports & Roadmaps | Apr 29, 2017
Power Integrations Awarded Double Damages in Patent-Infringement Case Against Fairchild Semiconductor
Power Integrations today announced that a federal district court has doubled the financial damages awarded to the company in its patent-infringement case against Fairchild Semiconductor. This action follows an earlier ruling in which the Court found that Fairchild's infringement of Power Integrations' patents was willful. Following the increase, the total damage award now stands at approximately $12 million. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Philips Welcomes Cooper Industries as Licensee for LED Luminaire Program
Eindhoven, The Netherlands – Philips (NYSE:PHG, AEX:PHI) announced today that they entered into a patent license agreement with Cooper Industries. The license provides Cooper with full access to the Philips’ LED-related patented technologies that Philips makes available to the lighting industry through its LED Luminaire and Retrofit Bulb licensing program. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
PHILIPS SSLS Licenses Patent Portfolio to Renaissance Lighting
Philips Solid-State Lighting Solutions, the new entity formed by Philips' acquisition of Color Kinetics, and Renaissance Lighting have completed a licensing agreement that provides Renaissance Lighting with access to Philips Solid-State Lighting Solutions' worldwide patent portfolio. The agreement enables Renaissance Lighting to offer its own intelligent LED lighting products, as well as to use Philips Solid-State Lighting Solutions' core technology in other new product development. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Philips Lumileds Initiates Notification of Epistar Infringement and ITC Exclusion Order to Chip Packagers and Users of Epistar`s OMA, MB, and GB LED Products
Philips Lumileds is notifying chip packagers, distributors and others using Epistar`s OMA, MB and GB LEDs that the U.S. International Trade Commission (ITC) has issued an order excluding importation of these products into the United States because they infringe Philips Lumileds` patent rights. The exclusion order prohibits importation of Epistar`s infringing LEDs as well as packaged LEDs containing the infringing LEDs and boards primarily consisting of arrays of such packaged LEDs. The Presidential Review period has ended and the ITC`s Exclusion Order is now final and in full force. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Philips Introduces Licensing Program for LED-based Luminaires
Eindhoven, The Netherlands – Today Philips (NYSE: PHG, AEX: PHI) introduces a patent licensing program for LED-based luminaires used in the general illumination, architectural and theatrical markets. It is Philips’ policy to share its intellectual property for basic control inventions for LED-based luminaires through licensing. This Philips IP addresses the basic control technologies required in a broad range of LED lighting applications. This new program extends the former Color Kinetics licensing program to enable faster growth of the Solid State Lighting market. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Patent Dispute - Next Round: Seoul Semiconductor filed a defamation lawsuit against Nichia
Seoul Semiconductor announced today that it has filed a defamation lawsuit against Nichia Corporation for Nichia’s false statements about N.D. Cal Case (“Design Case”) with Central District Court in Seoul, Korea. Seoul Semiconductor’s suit against Nichia, filed on January 7, 2008, seeks compensation for damages for defamation in the amount of 0.5 billion Korean won (approximately US$531,000). Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Packages for semiconductor LEDs utilizing dispensed reflectors and methods of forming the same
Packages for semiconductor LEDs utilizing dispensed reflectors and methods of forming the same A packaged LED includes a substrate, an LED chip on the upper surface of the substrate, a first encapsulant material, including a reflective material, on the substrate and spaced apart from the LED chip, and a second encapsulant material on the LED chip. A method of forming a packaged LED includes forming a first meniscus control feature on a substrate and defining a first region of the substrate, forming a second meniscus control feature surrounding the first region and defining a second region of the substrate between the first meniscus control feature and the second meniscus control feature, mounting an LED chip within the first region, dispensing a first encapsulant material including a reflective material within the second region, curing the first encapsulant material, dispensing a second encapsulant material on the substrate within the first region, and curing the second encapsulant material. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
OSRAM wins patent dispute with Kingbright in the German courts
The District Court of Düsseldorf has upheld almost all the claims of OSRAM Opto Semiconductors, one of the world’s leading manufacturers of opto-semiconductors, in its patent dispute with the Taiwanese LED manufacturer Kingbright. The court ruled that Kingbright had infringed basic patent and utility model rights of OSRAM Opto Semiconductors. In accordance with the judgment, Kingbright may no longer sell many of its LED products in Germany and must also destroy its stocks of these products currently in Germany. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Osram Relaxed about Samsungs Counter Claims in Korea
Osram had not seen Samsung’s complaint yet and did not know its specific content which has been issued in Korea. According to a spokesperson, Osram is well prepared regarding possible steps by Samsung and is therefore relaxed about the move by the counter claimant. Osram regards Samsung’s move as a typical counter attack of a defendant. Anticipating this move Osram had analyzed Samsung’s patent portfolio thoroughly before taking any legal actions and concluded that none of Samsung’s IP will cause a problem for any of OSRAM’s products. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
OSRAM Adds Another Renowned Manufacturer to Its List of Licensees
OSRAM has granted a license, in return for an appropriate fee, to PerkinElmer Inc., the American supplier of precision and photonic components, that allows it to manufacture and market white LEDs with conversion technology. The patent for this technology is held by the OSRAM subsidiary OSRAM Opto Semiconductors. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Organic light emitting diode (oled) having improved stability, luminance, and efficiency
Organic light emitting diode (oled) having improved stability, luminance, and efficiency An organic light emitting diode (OLED) includes a relatively thin diamnond-like carbon (DLC) layer disposed between the anode and the hole transport layer to improve luminous efficiency and operating life time. The relatively thin DLC layer inhibits hole injection, which balances charge flow and improves efficiency, and increases the surface smoothness of the anode, which contributes to the increased operating life time. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Northern District of California jury affirmed Seoul Semiconductor’s infringement of Nichia patents
Nichia Corporation announced today that the jury unanimously rendered a verdict that found the infringement of Nichia’s design patents in the infringement lawsuit in the United States District Court for the Northern District of California brought by Nichia Corporation (“Nichia”) against Seoul Semiconductor, Ltd. and Seoul Semiconductor, Inc.(verdict form) Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Nitride based LED with a p-type injection region
Nitride based LED with a p-type injection region An LED chip (2) is composed of a p-GaN layer (10), an n-GaN layer (14), and an MQW emission layer (12) that is sandwiched between the GaN layers (10 and 14). Each layer is made of a GaN semiconductor. Light exits the LED chip (2) through the n-GaN layer (14). A p-electrode (16) of the LED chip (2) has a surface profile (24B) defined by a plurality of columnar projections (24A) formed in a uniformly distributed relation on the surface facing toward the p-GaN layer (10). The p-electrode (16) is in contact with the p-GaN layer (10) at the top surface of each projection (24A). Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Nichia's actions against a US maker of Lighting Appliances
Nichia Corporation announced that it has recently reached resolution of an intellectual property dispute with a maker of Lighting Appliances in the U.S. Nichia has been actively pursuing its patent enforcement strategy and has been demanding that those who have sold products infringing Nichia's U.S. patents stop selling such products. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Nichia’s Patent Invalidated, Seoul Semiconductor Celebrates a Convincing Win
Korea Intellectual Property Tribunal (“KIPT”) ruled that a patent, related to LED element, (Patent # KP 491482, hereinafter “’482 patent”) owned by Nichia Corporation (“Nichia) is invalid based on lack of inventiveness. Thus yet another of Nichia’s patents has been invalidated by KIPT, following a ruling in July, 2008 when KIPT invalidated a previous Nichia patent. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Nichia Initiates U.K. Patent Infringement Lawsuit against Seoul Semiconductor based on the “Annealing Patent”
Nichia Corporation (“Nichia”) filed a new action for infringement and damages in the U.K. against Seoul Semiconductor Co., Ltd. (“Seoul Semiconductor”; incorporated in Korea) and other(s) based on the EP(UK) 0 541,373 patent, “Method of Manufacturing P-type Compound Semiconductor,”(the Annealing Patent) which is one of Nichia’s most important patents and relates to a thermal annealing method for manufacturing a p type GaN-based semiconductor. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Nichia Initiates DE Lawsuit Against Seoul Semiconductor's Acriche Products
Nichia Corporation (“Nichia”) filed a patent infringement lawsuit in Germany against a Korean company, Seoul Semiconductor Co. Ltd. (“Seoul Semiconductor”), a German subsidiary of Seoul Semiconductor, Seoul Semiconductor Europe GmbH, and its German distributor, Conrad Electronic SE seeking injunctive relief and compensation for damages. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Nichia files Patent Infringement Lawsuit (2nd Lawsuit) against Japan Seoul Semiconductor Co. Ltd. over White LEDs
Nichia Corporation (“Nichia”) announced today that it filed an action with Tokyo District Court against Seoul Semiconductor Co., Ltd. of Japan (“Seoul Semiconductor of Japan”), a Japanese subsidiary of Seoul Semiconductor Co., Ltd. (“Seoul Semiconductor”), in which Nichia claims for the prohibition of infringement upon the patent right held by Nichia and compensation for damages. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Nichia Files 4 Provisional Injunction Actions Against a Seller of LED Light Bulbs
Nichia Corporation announced today that it had filed four provisional injunction actions in Tokyo District Court to enjoin Tsannkuen Japan (Sankun Nihon Denki Kabushiki Kaisha) from infringing Nichia's patent. Nichia believes white LEDs used in certain LED light bulb products of Tsannkuen Japan, sold by G.K. Seiyu and K.K. Yamada Denki, infringe Nichia's white LED patents (No. 3724498, No. 3995011, No. 4109297, No. 4530094), and have come to file the provisional injunction actions in Tokyo District court. The patent is one of Nichia's patents concerning the technology of combining phosphor with blue LED, and is employed in many white LED products that combine phosphor with blue LED. Read more »
IP, Reports & Roadmaps | Apr 29, 2017
Nichia Brings US Patent Infringement Lawsuit against Seoul Semiconductor
Nichia Corporation ("Nichia") announced today that it filed a patent infringement suit on August 18, 2008, in the United States District Court for the Eastern District of Michigan against Seoul Semiconductor Co. Ltd. ("SSC"), a Korean company, its U.S. subsidiary, Seoul Semiconductor, Inc. and its U.S. distributor, Avnet, Inc, seeking an injunction from future infringements and an award of damages. Read more »
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